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Effect of treated silver nanoparticles to electrical conductivity improvement of electrically conductive adhesive (ECA)

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dc.citedby1
dc.contributor.authorKornain Z.en_US
dc.contributor.authorAmin N.en_US
dc.contributor.authorJalar A.en_US
dc.contributor.authorCheah A.Y.en_US
dc.contributor.authorAhmad I.en_US
dc.contributor.authorid24341024000en_US
dc.contributor.authorid7102424614en_US
dc.contributor.authorid11539926200en_US
dc.contributor.authorid26632778200en_US
dc.contributor.authorid12792216600en_US
dc.date.accessioned2023-12-29T07:57:07Z
dc.date.available2023-12-29T07:57:07Z
dc.date.issued2008
dc.description.abstractElectrically conductive adhesive (ECA) is a popular alternative to replace lead solder interconnect material in most areas of electronic packaging. ECA mainly consists of an organic/polymeric binder matrix and metal filler. These composite materials provide both physical adhesion and electrical conductivity. Compared to the solder technology, ECA offers numerous advantages, such as environmental friendliness, lower processing temperature, fewer processing steps (reducing processing cost), and especially, the fine pitch capability attributed to the availability of small sized conductive fillers. Here, 70-nm sized silver particle filler (Ag) has been used to study the effect to electrical conductivity of ECA after surface treatment. Upon surface treatment of silver with silane-based coupling agent, the treated silver filled epoxy system demonstrated incredible improvement in electrical properties. The current conductivity (DC) for treated filler was 4.01 S/cm compared with untreated filler with 4.54E-03 S/cm for 5%w filler loading. Morphological studies using light microscopy micrographs have shown perceptible enhancement in filler dispersivity after treatment. �2008 IEEE.en_US
dc.description.natureFinalen_US
dc.identifier.ArtNo4770385
dc.identifier.doi10.1109/SMELEC.2008.4770385
dc.identifier.epage553
dc.identifier.scopus2-s2.0-65949085355
dc.identifier.spage549
dc.identifier.urihttps://www.scopus.com/inward/record.uri?eid=2-s2.0-65949085355&doi=10.1109%2fSMELEC.2008.4770385&partnerID=40&md5=43ebfca4def82f625b3d8fb52d4eef5f
dc.identifier.urihttps://irepository.uniten.edu.my/handle/123456789/30977
dc.pagecount4
dc.sourceScopus
dc.sourcetitleIEEE International Conference on Semiconductor Electronics, Proceedings, ICSE
dc.subjectBrazing
dc.subjectChip scale packages
dc.subjectComposite micromechanics
dc.subjectCost reduction
dc.subjectCoupling agents
dc.subjectElectric conductivity
dc.subjectElectric network analysis
dc.subjectEpoxy resins
dc.subjectLead
dc.subjectProcessing
dc.subjectSilanes
dc.subjectSilver
dc.subjectSurface treatment
dc.subjectWelding
dc.subjectAfter-treatment
dc.subjectBinder matrix
dc.subjectConductive fillers
dc.subjectCurrent conductivity
dc.subjectDispersivity
dc.subjectElectrical conductivity
dc.subjectElectrical property
dc.subjectElectrically conductive adhesives
dc.subjectElectronic Packaging
dc.subjectEnvironmental friendliness
dc.subjectEpoxy systems
dc.subjectFiller loading
dc.subjectFine-pitch capability
dc.subjectInterconnect materials
dc.subjectLead solders
dc.subjectLight microscopy
dc.subjectMetal fillers
dc.subjectMorphological study
dc.subjectProcessing costs
dc.subjectProcessing steps
dc.subjectProcessing temperature
dc.subjectSilver nanoparticles
dc.subjectSilver particles
dc.subjectFillers
dc.titleEffect of treated silver nanoparticles to electrical conductivity improvement of electrically conductive adhesive (ECA)en_US
dc.typeConference paperen_US
dspace.entity.typePublication
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