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Role of alternating current shape on microstructure and damage evolution of solder joints

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dc.citedby3
dc.contributor.authorSiswanto W.A.en_US
dc.contributor.authorKrasnopevtsev A.Y.en_US
dc.contributor.authorTalarpoushti G.F.en_US
dc.contributor.authorMaseleno A.en_US
dc.contributor.authorKuzichkin O.R.en_US
dc.contributor.authorid42862458800en_US
dc.contributor.authorid37003766400en_US
dc.contributor.authorid57212762726en_US
dc.contributor.authorid55354910900en_US
dc.contributor.authorid23982900700en_US
dc.date.accessioned2023-05-29T08:11:20Z
dc.date.available2023-05-29T08:11:20Z
dc.date.issued2020
dc.descriptionDegradation; Mechanical properties; AC currents; Alternating current; Degradation of mechanical properties; Electronic package; Electronic systems; Micro-structural characterization; Solder joints; Thermal fluctuations; Electric impedance measurementen_US
dc.description.abstractMotivated by recent works indicating the role of AC current on the reliability of electronic systems, the microstructural characterization and mechanical properties of solder joints, as vulnerable parts of electronic packages, under different alternating current shapes were investigated. The sine-, square- and triangle-waveform currents were considered for the experiments. The simulation results showed that the triangle shape current creates the highest thermal fluctuations and stress variations in the solder joints. This event was due to the lack of any relaxation time at the critical states, induced by triangle shape current, which leads to the intensification of stress in the solder material. On the other side, the sine- and square- currents have time to relax stresses at their peak temperatures. Moreover, it was found that the stress intensification in the solder exposed to the triangle-shape current leads to the increase of brittle intermetallic compounds and the degradation of mechanical properties. Moreover, thermal resistivity of solder joints was considered as failure indicator and found that the triangle AC current had the significant effect on the increase of thermal resistivity in the solder joint in a certain time compared with other AC current shapes. � 2019 The Society of Manufacturing Engineersen_US
dc.description.natureFinalen_US
dc.identifier.doi10.1016/j.jmapro.2019.12.041
dc.identifier.epage455
dc.identifier.scopus2-s2.0-85077392144
dc.identifier.spage450
dc.identifier.urihttps://www.scopus.com/inward/record.uri?eid=2-s2.0-85077392144&doi=10.1016%2fj.jmapro.2019.12.041&partnerID=40&md5=dfcd1d44599bfa850ca27734d58f93cf
dc.identifier.urihttps://irepository.uniten.edu.my/handle/123456789/25588
dc.identifier.volume50
dc.publisherElsevier Ltden_US
dc.relation.ispartofAll Open Access, Green
dc.sourceScopus
dc.sourcetitleJournal of Manufacturing Processes
dc.titleRole of alternating current shape on microstructure and damage evolution of solder jointsen_US
dc.typeArticleen_US
dspace.entity.typePublication
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