Publication:
Finite element analysis of thermal distributions of solder ball in flip chip ball grid array using ABAQUS

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dc.citedby13
dc.contributor.authorKar Y.B.en_US
dc.contributor.authorTalik N.A.en_US
dc.contributor.authorSauli Z.en_US
dc.contributor.authorFei J.S.en_US
dc.contributor.authorRetnasamy V.en_US
dc.contributor.authorid26649255900en_US
dc.contributor.authorid55576358000en_US
dc.contributor.authorid24554644300en_US
dc.contributor.authorid55576523600en_US
dc.contributor.authorid24802373600en_US
dc.date.accessioned2023-12-29T07:44:13Z
dc.date.available2023-12-29T07:44:13Z
dc.date.issued2013
dc.description.abstractPurpose - The increased use recently of area-array technology in electronic packaging has similarly increased the importance of predicting the thermal distribution of area-array solder interconnection. As the interconnection technology for flip chip package is getting finer and smaller, it is extremely difficult to obtain the accurate values of thermal stresses by direct experimental measurements. Different types of solder bumps used for interconnection would also influence the thermal distribution within the package. Because the solder balls are too small for direct measurement of their stresses, finite element method (FEM) was used for obtaining the stresses instead. Design/methodology/approach - This paper will discuss the results of the thermal stress distribution using numerical method via ABAQUS software. The variation of the thermal stress distribution with the temperature gradient model was evaluated to study the effects of the different material thermal conductivity of solder bumps used. A detailed 2D finite element model was constructed to perform 2D plain strain elastoplastic analysis to predict areas of high stress. Findings - It is found that thermal distribution of solder bumps starts to propagate from the top region to the bottom region of the solder balls. Other than that, thermal stress effect increases in parallel with the increasing of the temperature. The simulation results shows that leaded solder balls, SnPb have higher maximum thermal stress level compared to lead-free SAC solder balls. Originality/value - The paper describes combination of stress with thermal loading correlation on a flip chip model. The work also shows how the different thermal conductivity on solder balls influences the thermal induced stress on the flip chip package. � Emerald Group Publishing Limited.en_US
dc.description.natureFinalen_US
dc.identifier.doi10.1108/13565361311298187
dc.identifier.epage18
dc.identifier.issue1
dc.identifier.scopus2-s2.0-84873155115
dc.identifier.spage14
dc.identifier.urihttps://www.scopus.com/inward/record.uri?eid=2-s2.0-84873155115&doi=10.1108%2f13565361311298187&partnerID=40&md5=0aa9c29473037984333c5e4c149f1407
dc.identifier.urihttps://irepository.uniten.edu.my/handle/123456789/30056
dc.identifier.volume30
dc.pagecount4
dc.sourceScopus
dc.sourcetitleMicroelectronics International
dc.subjectABAQUS
dc.subjectFinite element analysis
dc.subjectFlip chip
dc.subjectSolder ball
dc.subjectStress (materials)
dc.subjectThermal analysis
dc.subjectABAQUS
dc.subjectElectronics packaging
dc.subjectFinite element method
dc.subjectFlip chip devices
dc.subjectSoldering
dc.subjectStress concentration
dc.subjectThermal stress
dc.subjectThermoanalysis
dc.subjectABAQUS software
dc.subjectDesign/methodology/approach
dc.subjectDirect measurement
dc.subjectElasto-plastic analysis
dc.subjectElectronic Packaging
dc.subjectExperimental measurements
dc.subjectFinite element method FEM
dc.subjectFinite element models
dc.subjectFlip chip
dc.subjectFlip chip ball grid array
dc.subjectFlip-chip packages
dc.subjectHigh stress
dc.subjectInterconnection technology
dc.subjectLead-Free
dc.subjectPlain strain
dc.subjectSAC-solders
dc.subjectSolder balls
dc.subjectSolder Bump
dc.subjectSolder interconnections
dc.subjectStress(materials)
dc.subjectThermal distributions
dc.subjectThermal induced stress
dc.subjectThermal loadings
dc.subjectThermal stress effects
dc.subjectThermal conductivity
dc.titleFinite element analysis of thermal distributions of solder ball in flip chip ball grid array using ABAQUSen_US
dc.typeArticleen_US
dspace.entity.typePublication
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