Publication:
In depth study of lead frame tape residuein quad flat non-leaded package

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dc.citedby1
dc.contributor.authorNadaraja S.K.en_US
dc.contributor.authorYap B.K.en_US
dc.contributor.authorid57211503319en_US
dc.contributor.authorid26649255900en_US
dc.date.accessioned2023-05-29T07:23:25Z
dc.date.available2023-05-29T07:23:25Z
dc.date.issued2019
dc.descriptionDies; Electronics packaging; Optimization; Reinforced plastics; Semiconductor device manufacture; Design/methodology/approach; Electrical conductivity; Lead frame; Process capabilities; Semiconductor manufacturing; Thermoplastic adhesive; Viable solutions; Wire bonding; Adhesivesen_US
dc.description.abstractPurpose: Lead frame tape is a crucial support for lead frames in the IC assembly process. The tape residue on the quad flat non-leaded (QFN) could result in low reliability and failure in electrical conductivity tests. The tape residue would affect overall performance of the chips and contribute to low pass yield. The purpose of this paper is to present an in-depth study of tape residue and factors that may affect it. Design/methodology/approach: An experiment using lead frame and tapes from three manufacturers with two types of die bond adhesives, namely, die attach film (DAF) and wafer back coating (WBC), was conducted. Copper (Cu) wire bonding and die bonding performances were measured in terms of process capability, stitch bond strength and die attach strength. Findings: Results showed that no tape residue was observed on the thermoplastic adhesive-based lead frames manufactured by Hitachi after the de-taping process because of the tape�s thermoplastic adhesive properties. Originality/value: This paper studies the occurrence of tape residue and a viable solution for it through the correct process optimization and combination of semiconductor manufacturing materials. Factors that may affect tape residue have also been studied and further research can be done to explore other options in the future as an alternate solution. � 2019, Emerald Publishing Limited.en_US
dc.description.natureFinalen_US
dc.identifier.doi10.1108/MI-12-2018-0077
dc.identifier.epage136
dc.identifier.issue4
dc.identifier.scopus2-s2.0-85074210002
dc.identifier.spage129
dc.identifier.urihttps://www.scopus.com/inward/record.uri?eid=2-s2.0-85074210002&doi=10.1108%2fMI-12-2018-0077&partnerID=40&md5=4833422ab342e5c3e5d2d1dae3c337e6
dc.identifier.urihttps://irepository.uniten.edu.my/handle/123456789/24426
dc.identifier.volume36
dc.publisherEmerald Group Holdings Ltd.en_US
dc.sourceScopus
dc.sourcetitleMicroelectronics International
dc.titleIn depth study of lead frame tape residuein quad flat non-leaded packageen_US
dc.typeArticleen_US
dspace.entity.typePublication
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