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Physical properties of solid glass microsphere / epoxy / kenaf composite

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dc.contributor.authorMohammed Hisham bin Haja Kamaludeen
dc.date.accessioned2023-05-03T16:18:56Z
dc.date.available2023-05-03T16:18:56Z
dc.date.issued2020-02
dc.description.abstractThe research is aimed at producing and evaluating the physical properties of solid glass microsphere (SGM) packed with epoxy and kenaf composite. The first duty of the research is to produce different ratios of SGM packed epoxy and kenaf. The next work will be the assessment of the composites ' mass, thermal expansion and melting point. Using the formula process, density is calculated. The thermogravimetric analysis (TGA) is used to assess the melting point and the dilatometry to evaluate the thermal expansion. The effect of the different epoxy- and kenaf-filled SGM ratios was observed. Once checked in all three tests the different ratios of SGM filled with epoxy and kenaf also give a different reading. Because the SGM filled with epoxy and kenaf is light in weight and has an improvised physical property, it can be used as a substitute for many materials such as building materials, thermo flasks and in the aviation industry. And since the composite has good thermal properties, it can be used for electrical parts production. [1]en_US
dc.identifier.urihttps://irepository.uniten.edu.my/handle/123456789/21236
dc.subjectCompositeen_US
dc.subjectKenafen_US
dc.subjectEnoxy . SGMen_US
dc.titlePhysical properties of solid glass microsphere / epoxy / kenaf compositeen_US
dc.typeResource Types::text
dspace.entity.typePublication
oairecerif.author.affiliation#PLACEHOLDER_PARENT_METADATA_VALUE#
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