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An in-depth study of lead frame tape residue in quad flat non-leaded package

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dc.contributor.authorShri Kumaran Nadaraja
dc.date.accessioned2024-05-30T12:59:04Z
dc.date.available2024-05-30T12:59:04Z
dc.date.issued2019
dc.descriptionTK7872.T55 S57 2019
dc.description.abstractLead frame tape is crucial in the manufacturing of semiconductor integrated circuits (IC) as it acts as a support to the backside of the lead frame during the IC assembly process. The occurrence of Quad Flat Non-Leaded (QFN) tape residue is critical as affected IC units that are produced are of low reliability and fail electrical conductivity tests. This will influence overall performance of the chips and will contribute to a low pass yield as there are rejected units in the manufacturing industry. The occurrence of tape residue is studied by conducting an experiment using lead frame and tapes by three manufacturers with two die bond adhesives. Basic copper (Cu) wire bonding performances and die bonding performances are measured in terms of process capability, stitch bond strength and die attach strength are also discussed in this thesis to understand process limitations and challenges. The results are then compiled and analyzed to find a suitable combination of materials as a solution. Thermoplastic adhesive-based lead frame tape manufactured by Hitachi has no tape residue after de- taping in Mid-End Process.
dc.identifier.urihttps://irepository.uniten.edu.my/handle/123456789/32479
dc.language.isoen
dc.subjectThin film devices
dc.subjectIntegrated circuits
dc.titleAn in-depth study of lead frame tape residue in quad flat non-leaded package
dc.typeResource Types::text::Final Year Project
dspace.entity.typePublication
oaire.citation.endPage89
oaire.citation.startPage1
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